Tamper-resistant electronics system and improved method of manufacturing therefor

ABSTRACT

In accordance with the embodiments described herein, there is provided an enclosure system including an enclosure formed of an insulating material, and at least one heatsink arrangement formed of a thermally-conductive material. The heatsink arrangement includes a heat conductive surface configured as one of a pyramid, an inverted pyramid, a plateau, a spherical segment, and an inverted spherical segment. The heatsink arrangement in the enclosure system can be integrally formed from the enclosure such that a demarcation between the heatsink arrangement and the enclosure is water-tight. The enclosure and the heatsink arrangement can also be simultaneously integrally formed and enmeshed using additive manufacturing processes.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present invention is a continuation application of U.S. applicationSer. No. 16/200,428, entitled “TAMPER-RESISTANT ELECTRONICS SYSTEM ANDIMPROVED METHOD OF MANUFACTURING THEREFOR” and filed on Nov. 26, 2018,which claims benefit of priority to U.S. Provisional Patent ApplicationNo. 62/591,164, entitled “TAMPER-RESISTANT ELECTRONICS SYSTEM ANDIMPROVED METHOD OF MANUFACTURING THEREFOR” and filed on Nov. 27, 2017,both of which are specifically incorporated by reference herein for allthat they disclose and teach.

FIELD OF THE INVENTION

The present invention relates to secure electronic systems and, moreparticularly, to electronic systems with tamper-resistance andtamper-detection features.

BACKGROUND OF THE INVENTION

Protection of electronic systems against physical attackers is animportant aspect of security and military systems. For example, bank ATMmachines require tamper-resistant and/or tamper-detection features toprotect their electronic components from being accessed by intruders. Insuch machines, the electronic components are protected by, for instance,features that detect unauthorized attempts to remove access panels or topenetrate the enclosure by drilling a whole through the enclosure.Penetrations may be used to insert RF probes into the enclosure toidentify vulnerabilities or perform side channel attacks.

While a variety of technologies exist for tamper-resistance andtamper-detection for use with secure systems, attackers continue to findnew ways to thwart such protective features.

Additionally, many such secure electronic systems require the ability tocommunicate wirelessly with other electronic systems. That meansantennas and counterpoise planes need to be incorporated into theseelectronic systems, further complicating their designs and manufacturingprocesses.

SUMMARY OF THE INVENTION

In accordance with the embodiments described herein, there is providedan enclosure system including an enclosure formed of an insulatingmaterial, and at least one heatsink arrangement formed of athermally-conductive material. The heatsink arrangement includes at heatconductive surface configured as one of a pyramid, an inverted pyramid,a plateau, a spherical segment, and an inverted spherical segment.

In an embodiment, the heatsink arrangement in the enclosure system isintegrally formed from the enclosure such that a demarcation between theheatsink arrangement and the enclosure is water-tight. In an alternativeembodiment, the enclosure and the heatsink arrangement aresimultaneously integrally formed and enmeshed using additivemanufacturing processes.

In accordance with another embodiment, a system with tamper-resistancefeatures for securing containing components therein. The system includesan outer enclosure, integrally formed from a conductive material and aninsulating material, and a sensing circuit connected with the conductivematerial. The system also includes an alert circuit. A portion of theconductive material forms a plurality of overlapping conductive stripsseparated by the insulating material. The plurality of overlappingconductive strips are configured such that, when the out enclosure isbreached by, an interruption occurs in at least one of the plurality ofoverlapping conductive strips. The sensing circuit then detects theinterruption and activates the alert circuit to indicate that the outerenclosure has been compromised.

In accordance with an embodiment, the conductive material includes atleast one of a metal, carbon black, carbon nanotubes,graphene-polylactic acid composite, metal-based polymer composite, andgraphene composition.

In accordance with an embodiment, the insulating material includes atleast one of acrylonitrile butadiene styrene (ABS), thermoplasticpolyurethane (TPU), plastic, fiber glass reinforcement material, woodfiber, and carbon fiber.

In accordance with an embodiment, a system for containing electroniccircuitry therein is disclosed. The system includes an outer enclosure,integrally formed from a conductive material and an insulating material,and an antenna structure embedded within and integrally formed from theconductive material in the outer enclosure. The system further includesa counterpoise, also embedded within and integrally formed from theconductive material in the outer enclosure. The system also includes afirst port electrically connected with the antenna structure forproviding electrical access to the antenna by the electronic circuitrycontained within the system, and a second port electrically connectedwith the counterpoise for providing electrical access to thecounterpoise by the electronic circuitry contained within the system.The antenna structure and the counterpoise are not visible from outsidethe system, in accordance with an embodiment.

In accordance with an embodiment, a heatsink system includes a fin,including a thermally conductive core, and a plurality of thermallyconductive columns, in thermal connection with the thermally conductivecore. The heatsink system further includes a support structure partiallysurrounding the thermally conductive columns, while allowing a portionof each one of the thermally conductive columns to protrude through thesupport structure. The plurality of thermally conductive columns areconfigured to draw heat from its surroundings such that the heat istransferred to the fin, from which the heat is dissipated. Furthermore,the fin, the plurality of thermally conductive columns, and the supportstructure are simultaneously integrally formed using additivemanufacturing processes.

In still another embodiment, a system with tamper-resistance featuresfor securely containing components therein includes an outer enclosure,integrally formed from a conductive material and an insulating material,and a sensing circuit connected with the conductive material. The outerenclosure includes outer walls and a floor, covered by a lid. The outerwalls and the lid each includes embedded circuitry in electroniccommunication with each other when the lid is in a proper position withrespect to the outer walls. Consequently, if the lid is moved from theproper position, electronic communication between the embedded circuitryis broken and the system senses the outer enclosure has beencompromised.

In yet another embodiment, a stacked array interconnect for providingaccess to electronic circuitry embedded within an insulating material isdisclosed. The stacked array interconnect includes a plurality of padsarranged on a surface of the insulating material such that the pluralityof pads are electronically accessible from outside the insulatingmaterial. The stacked array interconnect also includes a plurality ofelectronic interconnects embedded within the insulating material andelectronically connecting at least a portion of the electronic circuitrywith at least one of the plurality of pads. Finally, the stacked arrayinterconnect includes a test point for connecting the plurality ofelectronic interconnects and providing access thereto from outside theinsulating material.

In accordance with another embodiment, an antenna counterpoise systemincludes an insulating material and a first conductive ring with a firstnumber of arms radiating therefrom and embedded within the insulatingmaterial. The system further includes a second conductive ring with asecond number of arms radiating therefrom and embedded within theinsulating material at a different plane from the first ring. The systemalso includes a coupler assembly located outside of the insulatingmaterial and in electrical communication with the first and secondconductive rings so as to provide electronic access to the first andsecond conductive rings by external electronic components. The firstnumber and the second number are different from each other such that thefirst and second conductive rings operate as antenna counterpoise forantennas tuned to different frequencies.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an enclosure with security features, in accordancewith an embodiment. A lid for the enclosure is not shown.

FIG. 2 illustrates the enclosure with security features, with a portionof the wall removed to show an exemplary configuration of an embeddedantenna, in accordance with an embodiment.

FIG. 3 illustrates an isolated view of the back wall of the enclosure,shown here to illustrate an exemplary configuration for attaching a pairof connectors thereon, in accordance with an embodiment.

FIG. 4 illustrates the isolated view of the back wall of the enclosure,with a portion of the wall material removed to show an exemplaryconfiguration of an embedded antenna with the pair of connectorsattached thereto, in accordance with an embodiment.

FIG. 5 illustrates additional security features that may be embeddedinto the enclosure with security features, in accordance with anembodiment, shown here with a portion of the wall removed to show theinternal details of embedded circuitry therein.

FIG. 6 illustrates a configuration for a heatsink, in accordance with anembodiment, shown here in elevation.

FIG. 7 illustrates the heatsink, shown here with a portion of the outermaterial removed to better illustrate the internal configuration of thecomponents, in accordance with an embodiment.

FIG. 8 shows a top view of the heatsink, in accordance with anembodiment.

FIG. 9 shows a side view of the heatsink, in accordance with anembodiment.

FIG. 10 illustrates another enclosure with security features, shown herewith an optional lid attached.

FIG. 11 illustrates the internal features within the enclosure, inaccordance with an embodiment, with the lid removed.

FIG. 12 illustrates further details of connectors embedded within thewalls of the enclosure, shown here with a portion of the outer materialremoved, in accordance with an embodiment.

FIG. 13 illustrates further details of the enclosure, shown here with aportion of the outer material removed to show a configuration in whichthe electronic circuitry in the case is connected with an embeddedantenna in the lid.

FIG. 14 illustrates an embedded counterpoise configuration, inaccordance with an embodiment.

FIG. 15 illustrates the embedded counterpoise configuration, inaccordance with an embodiment, shown here with a portion of the outermaterial removed to show details of the embedded features.

FIG. 16 illustrates the embedded counterpoise configuration, inaccordance with an embodiment, with the enclosing material removed.

FIG. 17 illustrates an exploded view of the embedded counterpoise, againwith the outer material removed, shown here to illustrate the details ofthe components, in accordance with an embodiment.

FIG. 18 illustrates a top view of a connector configuration, inaccordance with an embodiment.

FIG. 19 illustrates a top view of the connector configuration, with theouter material removed to show the details of the embedded circuitry.

FIG. 20 illustrates a top view of a two-connector configuration, inaccordance with an embodiment

FIG. 21 illustrates a top view of the two-connector configuration, withthe outer material removed to show the details of the embeddedcircuitry.

FIG. 22 shows an ISO view of an exemplary enclosure system with anembedded heatsink array, in accordance with an embodiment.

FIG. 23 shows a top view of an exemplary enclosure system with anembedded heatsink array, in accordance with an embodiment.

FIG. 24 shows an exploded view of an exemplary enclosure system with anembedded heatsink array, in accordance with an embodiment.

FIG. 25 shows an assembled exemplary enclosure system with an embeddedheatsink array, shown here in a partial cutaway view, in accordance withan embodiment.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION

The present invention is described more fully hereinafter with referenceto the accompanying drawings, in which embodiments of the invention areshown. This invention may, however, be embodied in many different formsand should not be construed as limited to the embodiments set forthherein. Rather, these embodiments are provided so that this disclosurewill be thorough and complete, and will fully convey the scope of theinvention to those skilled in the art. In the drawings, the size andrelative sizes of layers and regions may be exaggerated for clarity.Like numbers refer to like elements throughout.

It will be understood that, although the terms first, second, third etc.may be used herein to describe various elements, components, regions,layers and/or sections, these elements, components, regions, layersand/or sections should not be limited by these terms. These terms areonly used to distinguish one element, component, region, layer orsection from another region, layer or section. Thus, a first element,component, region, layer or section discussed below could be termed asecond element, component, region, layer or section without departingfrom the teachings of the present invention.

Spatially relative terms, such as “beneath,” “below,” “lower,” “under,”“above,” “upper,” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. It will beunderstood that the spatially relative terms are intended to encompassdifferent orientations of the device in use or operation in addition tothe orientation depicted in the figures. For example, if the device inthe figures is turned over, elements described as “below” or “beneath”or “under” other elements or features would then be oriented “above” theother elements or features. Thus, the exemplary terms “below” and“under” can encompass both an orientation of above and below. The devicemay be otherwise oriented (rotated 90 degrees or at other orientations)and the spatially relative descriptors used herein interpretedaccordingly. In addition, it will also be understood that when a layeris referred to as being “between” two layers, it can be the only layerbetween the two layers, or one or more intervening layers may also bepresent.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a,” “an,” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof. As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items, and may be abbreviated as “/”.

It will be understood that when an element or layer is referred to asbeing “on,” “connected to,” “coupled to,” or “adjacent to” anotherelement or layer, it can be directly on, connected, coupled, or adjacentto the other element or layer, or intervening elements or layers may bepresent. In contrast, when an element is referred to as being “directlyon,” “directly connected to,” “directly coupled to,” or “immediatelyadjacent to” another element or layer, there are no intervening elementsor layers present. Likewise, when light is received or provided “from”one element, it can be received or provided directly from that elementor from an intervening element. On the other hand, when light isreceived or provided “directly from” one element, there are nointervening elements present.

Embodiments of the invention are described herein with reference tocross-section illustrations that are schematic illustrations ofidealized embodiments (and intermediate structures) of the invention. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments of the invention should not be construed aslimited to the particular shapes of regions illustrated herein but areto include deviations in shapes that result, for example, frommanufacturing. Accordingly, the regions illustrated in the figures areschematic in nature and their shapes are not intended to illustrate theactual shape of a region of a device and are not intended to limit thescope of the invention.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and/orthe present specification and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

As mentioned earlier, in security systems, there is a need to create ananti-tamper boundary around electronics to protect them against physicalattacks. For example, an attacker may attempt to access the internalelectronics of a machine containing security-sensitive information byopening the outer enclosure of the machine, or even by drilling a smallhole in the outer enclosure so as to be able to insert a small camera toview the internal components of the machine, or insert an RF probe (suchas the COOLIEF Cooled Radio Frequency Probe from Halyard Worldwide,Inc.), thus allowing the attacker to reverse engineer the operation ofthe machine. The attacker may also attempt to wirelessly skim sensitiveinformation, if the machine wirelessly transmits or receives data.

One example of a security system is the keypad on an automated tellermachine (ATM). A user enters a personal identification number (PIN) codeusing the ATM keypad, which is then received at a processor within theATM (See, for example, U.S. Pat. No. 5,832,206 to De Jesus, et al.).ATMs generally require an anti-tamper boundary mechanism incorporatedinto its enclosure structure so as to protect the electronic componentscontained therein against intruder access. Ideally, the anti-tamperboundary mechanism detects when the enclosure structure has beenbreached by unauthorized removal of an access panel, or by invasivemeans, such as by drilling through the enclosure.

Existing anti-tamper bounder mechanisms include, for example, theaddition of a wire “mesh” on an internal wall of the machine enclosuresuch that, if the mesh is broken by an intruder attack, then the breachis detected and sensitive data within the machine may can be deleted orthe appropriate authorities notified. For example, U.S. PatentApplication Serial Number 2009/0145973 to Farooq, et al., discloses anIC module including a conductive grid structure embedded within the chipcarrier and the cap structure configured so as to detect an attempt topenetrate the IC module. Such mesh configurations are generally formedusing a laser or wet etch and deposition process, which limits theflexibility in design and materials used, as well as raising concernsregarding the compatibility and structural integrity of the resultingenclosure. Additionally, wire mesh configurations may still be breachedby, for instance, drilling between the wires with a very small drillbit.

Embodiments of the present invention are described herein with referenceto the figures, described in detail hereinafter. The embodimentsdescribed herein overcome the shortcomings of the existing art in avariety of ways, as illustrated below.

FIG. 1 shows an enclosure 100 including tamper-resistant features, inaccordance with an embodiment as will be described in detail immediatelybelow. It should be noted that a lid (not shown) has been removed fromenclosure 100 in order to better illustrate the internal componentstherein. Enclosure 100 includes a plurality of holes 102 for securingthe lid (not shown) onto a box 110. Enclosure 100 also includes a pairof antenna connections 120, through which an electrical connection to anembedded antenna may be made.

Further details of the embedded antenna are shown in FIG. 2, whichillustrates enclosure 100 of FIG. 1 with a portion of the materialforming box 110 to show an embedded antenna 200. Embedded antenna 200includes a wire antenna 230 and a ground plane 232, both of which areelectronically accessed via the pair of antenna connections 120.

FIGS. 3 and 4 illustrate isolated views of the same antenna connectionsand embedded antenna configuration, shown here with connectors 140connected with antenna connections 120 attached by screws 142. FIG. 3shows an isolated view of the back wall of box 110, while FIG. 4 showsthe same isolated view with a portion of the wall material removed toshow details of embedded antenna 200 embedded within box 110.

A key aspect of the configuration of embedded antenna 200 is that,rather than having been manufactured by first forming box enclosure,etching away a portion of a wall of the box enclosure, depositing aconductive material to form the wire antenna, then enclosing the wireantenna with additional material, embedded antenna 200 has been formedby additive manufacturing methods such that box 110, embedded antenna200, and even antenna connections 120 are integrally formed in acontinuous manufacturing process without requiring wet etch ordeposition processes.

A variety of additive manufacturing solutions (also commonly referred toas 3D printing) exist and any additive manufacturing process can be usedto manufacture the enclosure with tamper-resistant features of thepresent embodiment, particularly those processes involving thesimultaneous printing of multiple materials using multiple feed nozzlesor the ability to cleanly change supplied materials from a single feedthe during the printing process. Such an integrative manufacturingprocess allow the simultaneous manufacture of both the enclosurematerial as well as circuitry embedded therein, with additionaladvantages in the design of the embedded features, as will be furtherdescribed below.

A key aspect of the additive manufacturing process suitable for use inmanufacturing the embodiments described herein is the ability tointermix materials (e.g., an insulating material and a conductivematerial) in a single print layer. The additive manufacturing processfurther enables the ready manufacturing of heretofore impossible ordifficult structures for tamper-resistance and tamper-detection.Suitable materials for use in manufacturing the embodiments shown hereinare, for example and not limited to, printable metals and graphenecompositions for the conductive material, and plastics, fiber glassreinforcement materials, wood fiber, and carbon fiber.

In an exemplary embodiment, a multi-head 3D printing approach may beused to print both conductive and non-conductive materials in amulti-layer, additive process. At least one print head contains aconductive material, such as a metal or a graphene mixture, while atleast one other print head contains a non-conductive material, such as aplastic, a glass fiber, carbon fiber, or other suitable material. Afteran overall embedded circuit and enclosure design has been finalized, a3D printing designer would convert the design using a slicer program tocreate commands to the printer nozzles for printing the additive layers.In this way, an enclosure system with embedded security features can beintegrally formed in a continuous process, without the need for wet orlaser etching and deposition processes.

FIG. 5 shows a rotated view of enclosure 100, shown here with anotherportion of box 110 cut away to illustrate details of a security mesh500, in accordance with an embodiment. An inset 501 shows details ofsecurity mesh 500, which includes a plurality of conductive strips 510,which run the length of box 110 from top to bottom, in the present viewas shown in FIG. 5. Conductive strips 510 are oriented such thatconductive strips in different layers within the walls of box 110 areoverlapped, when viewed from outside of box 110. In this way, unlikeprevious versions of wire mesh, there is essentially no space throughwhich a hole may be drilled through enclosure 100 without breaking oneor more of conductive strips 510. An isolated view of conductive strips510, with the material forming the wall of box 110 removed, is shown inan inset 550.

Continuing to refer to FIG. 5, security mesh 500 may also include aplurality of channels 520, also running the length of box 110 from topto bottom in the shown embodiment. Cavities 200 are configured suchthat, if an external compressive force is applied to box 110 andchannels 520 become compressed or crushed, then one of more ofconductive strips 510 are disturbed or broken, thus alerting theoperator to an attempt for unauthorized access into enclosure 100.

Channels 520 also provide acoustic dampening against acoustic attacks tothe electronics contained within enclosure 100. For instance,side-channel attacks or by capturing acoustic emissions are knownthreats to computer security (See, for example, “Stealing Keys from PCsusing a Radio: Cheap Electromagnetic Attacks on Windowed Exponentiation”by D. Genkin, et al. (https://eprint.iacr.org/2015/170.pdf) and “RSA KeyExtraction via Low-Bandwidth Acoustic Cryptanalysis” by D. Genkin, etal. (http://www.cs.tau.ac.il/˜tromer/acoustic/)). Conductive strips 510and channels 520 provide additional insulation and interference to helpthwart such side channel attacks.

The use of the additive manufacturing approach to the formation ofenclosures with security features also lends itself to the design andintegration of other structures that maybe used with the enclosure or inapplications outside of security devices. An example of such a device isa heat sink illustrated in FIGS. 6-9. FIG. 6 shows, in elevation, a heatsink 600 including a fin 610, a plurality of columns 620 supportedwithin a support structure 625, and a plurality of attachment holes 630for attaching heat sink 600 to the surface for which heat mitigation isdesired.

FIG. 7 shows further details of the internal configuration of heat sink600, with a portion of support structure 625, attachment holes 630, andthe outer material enclosing fin 610 removed to show a core 710. Columns620 and core 710 are thermally conductive and are thermally connected toeach other such that columns 620 pull heat out of the environment or thesurface to which heat sink 600 is attached, then transfers the heat viacore 710 to be radiated from fin 610. FIG. 8 shows a top view of heatsink 600, and FIG. 9 shows a side view of heat sink 600, shown here toillustrate the orientation of the different components within heat sink600. All parts of heat sink 600 can be integrally formed in a singleprocess by additive manufacturing methods using at least two differentmaterials to form the thermally conductive components at the same timeas the insulating components.

Turning now to FIGS. 10-13, another embodiment of an enclosure includingsecurity features is illustrated. An enclosure 1000, from the outside asshown in FIG. 10, looks like an ordinary enclosure, including a box 1010covered by a lid 1015, with a plurality of holes 1017 through which lid1015 is affixed to box 1010. When lid 1015 is removed, as shown in FIG.11, a variety of security features become visible.

Continuing to refer to FIG. 11, the inner details of enclosure 1000 areshown with the lid removed. As an option, an access port 1110 providesaccess to components within enclosure 1000. As shown in FIG. 11,enclosure 100 includes an inner frame 1120, onto which electroniccomponents, such as a printed circuit board, can be attached. Also,optionally, inner frame 1120 may be formed of insulating materials suchthat electronic components mounted thereon are electrically isolatedfrom the rest of enclosure 1000. The inner surfaces of box 1010 furtherincludes honeycomb features 1130 integrated into the material formingbox 1010. As an example, honeycomb features 1130 may be formed ofconductive materials separated by apertures 1135 so as to form a part ofa security mesh embedded into the inner surface of box 1010.

Certain features of enclosure 1000 are highlighted in insets. As shownin a first inset 1140, a first end 1145 of an integrated connector (notvisible in FIG. 11), which has been embedded within box 1010. A secondinset 1160 shows second ends 1165 of the integrated connector.Integration of the integrated connector into the walls of box 1010provides advantages in protecting the connector from getting jostled,broken, or shorted during handling of enclosure 1000.

Further details of the integrated connector are shown in FIG. 12, whichshows the internal components of enclosure 1000, with portions of box1010 removed. As is visible in FIG. 12, first ends 1145 of theintegrated connector are configured to just flush with a top edge of box1010 (as shown in FIG. 11), while being connected within the walls ofbox 1010 through to second ends 1165. In an exemplary embodiment, shownin FIG. 13, an antenna structure 1310 and a ground plane 1315 areembedded within lid 1015. Antenna structure 1310 and ground plane 1315are connected via couplers 1345 with first ends 1145 of the integratedconnector embedded within box 1010. If lid 1015 is removed by anunauthorized user, for instance, the disconnection of couplers 1345 inthe lid from first ends 1145 of box 1010 can trigger a shutdown sequenceto protect data stored on electronic components mounted within enclosure1000.

Another heretofore unavailable embedded circuit design enabled by theuse of additive manufacturing is an embedded antenna counterpoisearrangement. Referring now to FIGS. 14-17, an exemplary arrangement of acounterpoise, in accordance with an embodiment, is illustrated. Acounterpoise arrangement 1400 includes a coupler assembly 1410, which inturn includes threads 1420 for connecting with external connectors, acore 1430 through which electrical connection can be made to componentson the other side of coupler assembly 1410, and a washer arrangement1440. Coupler assembly 1410 is connected through an insulating material1450 with coupler ring 1460.

Further components embedded within insulating material 1450 are shown inFIG. 15, in which a portion of insulating material 1450 has beenremoved. In FIG. 15, a plurality of radial arms arrangement 1510embedded within insulating material 1450 are visible, as well as a backend 1520 of coupler assembly 1410. FIG. 16 shows coupler assembly 1410as well as radial arms arrangement 1510 with all of the insulatingmaterial removed.

Details of the radial arms are better visible in FIG. 17, which shows anexploded view of the coupler assembly 1410 along with a plurality ofradial arms connecting with a plurality of pads 1710 embedded within aninsulating material 1750. As may be seen in FIG. 17, each of radial armsarrangements 1510A, 1510B, 1510C, and 1510D in this exemplary embodimenthave different numbers of radial arms emanating from a central ring. Thenumber of arms in each radial arms arrangement corresponds to aparticular antenna frequency such that, with multiple radial armsarrangements tuned to different frequencies, this counterpoise designcan be used with multiple selected antenna frequencies.

Examples of configurations for pads 1710 are shown in FIGS. 18-21. InFIG. 18, a single embedded connector system 1800 is shown. Embeddedconnector system includes, embedded within an insulating material 1810,a plurality of pads 1820 around a hole 1830. A test point 1840 is alsovisible and embedded within insulating material 1810.

The internal connections within embedded connector system 1800 may bebetter seen with insulating material 1810 removed for clarity. As may beseen in FIG. 19, pads 1820 serve as an interface to external componentsvia, for instance, coupler ring 1460. Pads 1820 are connected, withininsulating material 1810, by a ring wire 1910. Certain pads 1820 arealso connected via wires 1920, also embedded within the insulatingmaterial, to test point 1840.

Two or more of embedded connector systems 1800 can be connectedtogether, as shown in FIGS. 20 and 21. FIG. 20 shows the surface-visibleportions of two embedded connector systems, which are coupled togetherinternally (not visible in FIG. 20) within insulating material 2010. Asshown in FIG. 21, the embedded connector systems may be connected,within the insulating material via a connective serpentine 2110, forexample. Such connection systems are useful in providing electricalconnections to otherwise buried components within an insulatingmaterial, while providing flexibility in the design of the electricalcomponents.

Turning now to FIGS. 22 and 23, ISO and top views of an exemplaryembodiment of an enclosure system with an embedded heatsink array areshown. As shown in FIGS. 22 and 23, an enclosure system 2200 includes aninsulting enclosure 2210 with an array of heatsink arrangements 2200. Itis noted that, while an array of heatsink arrangements is shown in FIGS.22-25, a single heatsink arrangement can be effectively used in small orspace-constrained applications.

Continuing to refer to FIGS. 22 and 23, insulating enclosure 2210 canoptionally include tamper-resistance features, embedded electroniccircuitry, embedded interconnects, and/or embedded antenna counterpoisetherein (not shown). Each one of heatsink arrangements 2200 includes anouter rim 2222 and a heat transfer surface 2224. Heat transfer surface2224 is configured as an inverted (sunken) pyramid, in this exemplaryembodiment. The inverted pyramid structure is chosen to provideincreased surface area for the heat transfer surface, while also beingrelatively simple to manufacture using conventional or additivemanufacturing techniques. Other geometrical shapes, such as trapezoids,circles, spherical segments, and other polygons are also contemplatedfor specific applications.

Insulating enclosure 2210 is formed of an insulating material such asplastic, fiber glass, carbon fiber, KEVLAR® aramid fiber, XSTRAND™ glassfiber, ceramics, and others mentioned above. Heatsink arrangements 2200are formed, for example, of thermally conductive materials such asgraphene, metal, and others mentioned above. While heatsink arrangementsshould be formed of a thermally conductive material, they may also beformed of a thermally conductive, yet electrically non-conductivematerial. Forming the heatsink arrangement from a thermally conductive,yet electrically non-conductive material allows the integration of theheatsink arrangements in close proximity to electronic circuitry withoutinterfering with the functions thereof.

In an embodiment, enclosure system 2200 is produced using additivemanufacturing techniques such that insulating enclosure 2210 and arrayof heatsink arrangements 2200 are additively produced in a singleproduction run. For instance, multi jet or multiple head printingtechniques are used to build enclosure system 2200, including both theinsulating enclosure and heatsink arrangements, in layers in a singleproduction run. The integrated production by additive manufacturing ofinsulating enclosure 2210, array of heatsink arrangements 2200, and,optionally, tamper-resistance and security features is particularlyadvantageous as the enmeshing of the various layers and components as aresult of the additive manufacturing yields an overall enclosure withsuperior water resistance and tight seals, even between the enclosureand the array of heatsink arrangements.

In an alternative embodiment, the insulating enclosure and one or moreheatsink arrangements can be formed separately then assembled. Such analternative assembly is illustrated in FIGS. 24 and 25. FIG. 24 shows anexploded view of an enclosure system 2400 with an embedded heatsinkarray, in accordance with an embodiment. FIG. 25 shows the assembledenclosure system 2400 with an embedded heatsink array, shown here in apartial cutaway view.

As shown in FIGS. 24 and 25, enclosure system 2400 includes an enclosure2410 and a heatsink substrate 2412. Heatsink substrate 2412 supports oneor more heatsink arrangements 2420 thereon. In an embodiment, each oneof heatsink arrangements 2420 includes an outer rim 2422 and a heattransfer surface 2424. While an array of four heatsink arrangements 2412is shown in FIGS. 24 and 25, some application require fewer heatsinks.Even one heatsink, enclosed in an enclosure as described herein, iseffective for heat transfer in certain applications. Additionally, whileheatsink arrangements 2420 are shown to include an inverted pyramidstructure as the heat transfer surface, other geometrical shapes arecontemplated to match the needs of specific applications.

Continuing to refer to FIGS. 24 and 25, enclosure 2410 of enclosuresystem 2410 further includes openings 2432 to match the array ofheatsink arrangements 2420 such that each one of the heatsinkarrangements matingly engages with one of the openings in the enclosure,as shown in FIG. 25. Heatsink substrate 2412, outer rim 2422, enclosure2410, and/or openings 2432 can include retention features (not shown),such as clips, snaps, dovetails, and the like, in order to ensureheatsink substrate 2412 is held against enclosure 2410. Additionalfeatures, such as one or more gaskets and/or sealants, can also be usedto ensure a water-tight seal between heatsink substrate 2412 andenclosure 2410. Furthermore, enclosure 2410 can optionally includetamper-resistance features, embedded electronic circuitry, embeddedinterconnects, and/or embedded antenna counterpoise therein (not shown)as previously described elsewhere in the present disclosure.

The foregoing is illustrative of the present invention and is not to beconstrued as limiting thereof. Although a few exemplary embodiments ofthis invention have been described, those skilled in the art willreadily appreciate that many modifications are possible in the exemplaryembodiments without materially departing from the novel teachings andadvantages of this invention. For example, newly developed materialssuitable for additive manufacturing may be used to form the conductiveand insulating components in the embodiments described above. Moreover,alternative additive manufacturing techniques, such as other methods forsimultaneously dispensing conductive and insulating materials, may beadapted for fabricating the embodiments described above. Furthermore,while additive manufacturing methods, such as 3D printing, arecontemplated for the fabrication of the embodiments described above,other suitable manufacturing processes that allow the simultaneousformation of both conductive and insulating elements in an integratedmanner are also contemplated.

Accordingly, many different embodiments stem from the above descriptionand the drawings. It will be understood that it would be undulyrepetitious and obfuscating to literally describe and illustrate everycombination and subcombination of these embodiments. As such, thepresent specification, including the drawings, shall be construed toconstitute a complete written description of all combinations andsubcombinations of the embodiments described herein, and of the mannerand process of making and using them, and shall support claims to anysuch combination or subcombination.

In the specification, there have been disclosed embodiments of theinvention and, although specific terms are employed, they are used in ageneric and descriptive sense only and not for purposes of limitation.Although a few exemplary embodiments of this invention have beendescribed, those skilled in the art will readily appreciate that manymodifications are possible in the exemplary embodiments withoutmaterially departing from the novel teachings and advantages of thisinvention. Accordingly, all such modifications are intended to beincluded within the scope of this invention as defined in the claims.Therefore, it is to be understood that the foregoing is illustrative ofthe present invention and is not to be construed as limited to thespecific embodiments disclosed, and that modifications to the disclosedembodiments, as well as other embodiments, are intended to be includedwithin the scope of the appended claims. The invention is defined by thefollowing claims, with equivalents of the claims to be included therein.

That which is claimed:
 1. A method of additively manufacturing anintegrally formed apparatus using a three-dimensional printing deviceincluding a first print head and a second print head, the methodcomprising: depositing an insulative material by the first print head aspart of forming a first layer; depositing a conductive material by thesecond print head, concurrently with depositing the insulative materialwith the first print head, as an additional part of forming the firstlayer, wherein the conductive material and the insulative material aredeposited to form the integrally formed apparatus, and wherein theconductive material is embedded in the insulative material in the firstlayer; depositing the insulative material by the first print head aspart of forming a second layer; and depositing the conductive materialby the second print head, concurrently with depositing the insulativematerial with the first print head, as an additional part of forming thesecond layer, wherein the conductive material and the insulativematerial are deposited in the second layer to form the integrally formedapparatus, and wherein the conductive material is embedded in theinsulative material in the second layer.
 2. The method of claim 1,wherein the conductive material is deposited in contact with theinsulative material when forming the first layer.
 3. The method of claim1, wherein the insulative material is deposited in contact with theconductive material when forming the first layer.
 4. The method of claim1, wherein the conductive material is entirely embedded in theinsulative material such that the conductive material is not visible inthe integrally formed apparatus.
 5. The method of claim 1, wherein theconductive material includes an electrically conductive material and theinsulative material includes an electrically insulative material.
 6. Themethod of claim 5, wherein the integrally formed apparatus is anembedded antenna, the conductive material forms an antenna component,and the insulative material forms an insulating enclosure component. 7.The method of claim 5, wherein the integrally formed apparatus is asecure enclosure, the conductive material forms a security meshincluding one or more conductive strips, and the insulative materialforms an insulating enclosure.
 8. The method of claim 1, wherein theconductive material includes a thermally conductive material and theinsulative material includes a thermally insulative material.
 9. Themethod of claim 8, wherein the integrally formed apparatus is aheatsink, the conductive material forms one or more heatsink structures,and the insulative material forms an insulating enclosure.
 10. Themethod of claim 9, wherein the heatsink further includes a finintegrally formed from the conductive material.
 11. An integrally formedapparatus formed by an additive manufacturing process of: depositing aninsulative material by a first print head as part of forming a firstlayer; depositing a conductive material by a second print head,concurrently with depositing the insulative material, as an additionalpart of forming the first layer, wherein the conductive material and theinsulative material are deposited to form the integrally formedapparatus, and wherein the conductive material is embedded in theinsulative material; and depositing the insulative material by the firstprint head as part of forming a second layer; and depositing theconductive material by the second print head, concurrently withdepositing the insulative material with the first print head, as anadditional part of forming the second layer, wherein the conductivematerial and the insulative material are deposited in the second layerto form the integrally formed apparatus, and wherein the conductivematerial is embedded in the insulative material in the second layer. 12.The integrally formed apparatus of claim 11, wherein the conductivematerial is deposited in contact with the insulative material whenforming the first layer.
 13. The integrally formed apparatus of claim11, wherein the conductive material is deposited in contact with theinsulative material when forming the first layer.
 14. The integrallyformed apparatus of claim 11, wherein the integrally formed apparatus isan embedded antenna, the conductive material includes an antennacomponent, and the insulative material includes an enclosure component.15. The integrally formed apparatus of claim 11, wherein the integrallyformed apparatus is a secure enclosure, the conductive material includesa security mesh including one or more conductive strips, and theinsulative material includes an enclosure.
 16. The integrally formedapparatus of claim 11, wherein the integrally formed apparatus is aheatsink, the conductive material includes one or more heatsinkapparatus, and the insulative material includes an enclosure.
 17. Anintegrally formed device comprising: a conductive material embedded inan insulative material, the insulative material and the conductivematerial both concurrently deposited on a first layer of the integrallyformed device by a three-dimensional printer, wherein the insulativematerial is deposited by a first print head of the three-dimensionalprinter and the insulative material is deposited by a second print headof the three-dimensional printer.
 18. The integrally formed device ofclaim 17, wherein the integrally formed device is an embedded antenna,the conductive material comprises an antenna component, and theinsulative material comprises an enclosure component.
 19. The integrallyformed device of claim 17, wherein the integrally formed device is asecure enclosure, the conductive material comprises a security meshincluding one or more conductive strips, and the insulative materialcomprises an enclosure.
 20. The integrally formed device of claim 17,wherein the integrally formed device is a heatsink, the conductivematerial comprises one or more heatsink apparatus, and the insulativematerial comprises an enclosure.